← Rendering

EUV Lithography

The machinery behind the chip, in close-up — tin droplet source, mirror optics and the finished wafer across eight scenes.

Category
AI rendering
Client
Personal project
Role
3D/AI artist
Tools
Cinema 4D, ComfyUI
Year
2026
Tin droplet source nozzle releasing a falling chain of molten metal droplets, purple and gold housing

Droplet source

3D Input

Untextured grey-clay 3D model of the droplet source nozzle, built in Cinema 4D before AI refinement

Scenes

Cooling jets misting a glowing curved metal edge, sparks flying through the vapour
A laser striking a falling tin droplet, flattening it into a glowing plasma disc that emits EUV light
Close-up of the plasma ignition — a bright burst of light and sparks erupting where the laser meets the droplet, inside the vacuum chamber
Interior of the optics chamber, a laser beam bouncing between a chain of large curved mirrors
A silicon wafer under a cone of light on the scanner stage, chip dies reflecting in rainbow colours
Extreme close-up of a wafer surface, a grid of chip dies in shifting blue, green and amber hues
Microscopic view of chip interconnects, rows of metal contacts with gold solder points
Close-up of etched chip structures, grey trenches with gold-capped contact points